
Hardware
Huawei’s 122 TB SSD Uses Die‑on‑Board Packaging to Bypass US‑Restricted 3D NAND
5/23/2026

Chips
YMTC's Wuhan Expansion Signals China's 3D NAND Push Amid Tooling Restrictions
4/16/2026

Chips
Memory Hoarding and Price Surges Squeeze Entry-Level Electronics, Foundry Orders Plummet
2/12/2026

Infrastructure
Micron Breaks Ground on Massive $24 Billion 3D NAND Fab in Singapore
1/28/2026
Chips
IEDM 2025 Signals Semiconductor Shift: 3D NAND Revival, Copper Alternatives, and Silicon Challengers Reshape Chip Economics
1/14/2026