Apple Explores Intel Chip Partnership to Diversify Beyond TSMC
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Apple Explores Intel Chip Partnership to Diversify Beyond TSMC

Smartphones Reporter
2 min read

Apple is reportedly negotiating with Intel to manufacture future A-series and M-series chips using Intel's upcoming 14A process, aiming to reduce reliance on TSMC while maintaining its chip design independence.

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Apple is actively pursuing manufacturing partnerships to reduce its dependence on TSMC, with Intel emerging as a key contender for future chip production according to multiple industry sources. Analyst Jeff Pu of GF Securities confirms ongoing discussions between Apple and Intel, with plans for Intel to fabricate portions of Apple's A21 and A22 smartphone processors using its advanced 14A process technology starting in 2028.

The collaboration would follow Apple's established manufacturer-client model: Apple designs its silicon in-house while outsourcing fabrication. Intel would join TSMC as a secondary supplier, though TSMC remains Apple's primary foundry partner. This diversification strategy mitigates supply chain risks and potentially improves negotiation leverage. Intel's 14A process represents its most advanced node yet, utilizing Angstrom-scale transistors that enable higher transistor density and improved power efficiency compared to previous generations.

Notably, the partnership could extend beyond iPhone chips. Industry analyst Ming-Chi Kuo suggests Intel might also manufacture lower-tier M-series processors for MacBooks and iPads as early as mid-2027. This aligns with Apple's strategy to segment its silicon portfolio, reserving TSMC's most advanced nodes for flagship products while utilizing alternative foundries for cost-optimized variants.

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The move holds significant implications for Intel Foundry Services, which aims to become a major player in the contract chipmaking market. Successfully landing Apple as a client would validate Intel's process technology and manufacturing capabilities. For Apple, partnering with Intel provides geographic diversification beyond Taiwan-based TSMC, reducing geopolitical risks. It also introduces healthy competition between foundries, potentially accelerating innovation and cost efficiency across the industry.

Technical challenges remain before production begins. Intel must demonstrate consistent yield rates and performance parity with TSMC's equivalent nodes. The 14A process is still in development, with mass production not expected until late 2028. Industry watchers will monitor Intel's progress with its 18A node launching in 2026, which serves as the technological precursor to 14A.

This potential partnership reflects broader industry trends toward multi-sourcing strategies. Samsung Foundry recently secured orders for 2nm chips, intensifying competition in advanced semiconductor manufacturing. As Apple expands its ecosystem across iPhones, Macs, and wearables, diversified chip production becomes increasingly critical for supply chain resilience and meeting growing global demand.

For consumers, this transition should remain invisible—Apple's strict performance standards ensure consistent user experience regardless of manufacturing origin. The long-term benefit lies in stabilized supply chains that prevent product delays and potentially lower component costs. With Intel's foundry ambitions detailed on their official portal and TSMC's roadmap outlined on their technology page, the semiconductor landscape continues evolving toward increased competition and specialization.

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