Qualcomm learning from Samsung: Snapdragon 8 Elite Gen 6 could run cooler thanks to Exynos

The mobile processor arms race is heating up, but Qualcomm might be taking a page from Samsung's playbook to keep things cool. According to leaker Fixed Focus Digital on Weibo, Qualcomm is planning to implement HPB (Heat Path Block) thermal solution technology in its upcoming Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro chips.

This cooling innovation comes directly from Samsung's recent success with the Exynos 2600 chip, which powers some Galaxy S26 models. The HPB technology allows for more efficient heat dissipation, addressing one of the main criticisms of previous Exynos offerings. For Qualcomm, this couldn't come at a better time.

The overheating problem that needs solving

The Snapdragon 8 Elite Gen 5, despite its impressive performance capabilities, faced significant thermal challenges. While everyday usage showed no major issues, early reports indicated devices overheating during intensive benchmark testing. This thermal throttling not only affects peak performance but can also impact long-term device longevity.

Mobile processors are becoming increasingly powerful, with the Snapdragon 8 Elite Gen 6 expected to push frequencies even higher. Leaks suggest one variant could hit at least 5 GHz minimum, boosting up to 5.5 GHz. At these speeds, efficient cooling isn't just a luxury—it's a necessity.

What we know about the Snapdragon 8 Elite Gen 6

Information remains scarce, but several key details have emerged:

• Manufacturing process: The new chips could use Samsung's 2nm process, with some variants sticking with TSMC's 2nm process
• Performance targets: Frequencies potentially reaching 5.5 GHz
• Pro variant features: Expected to include a more capable GPU and support for LPDDR6 memory

Qualcomm hasn't officially shared any information about the next generation of Snapdragon flagship mobile processors, so these details should be taken as speculative for now.

Why HPB technology matters

The Heat Path Block solution represents a significant advancement in mobile chip cooling. Traditional cooling methods often struggle to keep pace with the increasing power density of modern processors. HPB creates more efficient thermal pathways, allowing heat to dissipate more effectively without requiring bulkier cooling solutions that would be impractical in smartphones.

This technology could be particularly crucial for the Pro variant, which is rumored to feature enhanced GPU capabilities. Graphics processing tends to generate substantial heat, especially during gaming or other GPU-intensive tasks.

The competitive landscape

Qualcomm's adoption of Samsung's cooling technology highlights the increasingly collaborative nature of the mobile processor industry. While companies compete fiercely on performance and features, they also recognize the value in adopting proven solutions from competitors.

This move could help Qualcomm address one of the few weaknesses in its Snapdragon lineup while maintaining its position as the dominant mobile processor provider. For consumers, this means potentially better sustained performance and longer device lifespans.

The Snapdragon 8 Elite Gen 6 and its Pro variant are expected to launch later this year, though exact timing remains unclear. As these chips make their way into flagship devices, the effectiveness of the HPB cooling solution will be closely scrutinized by reviewers and enthusiasts alike.

For now, we'll have to wait for official announcements from Qualcomm and see how this cross-pollination of technology plays out in real-world devices. One thing is certain: as mobile processors continue to push performance boundaries, innovative cooling solutions like HPB will become increasingly essential.