SK Hynix Overtakes Samsung in Operating Profit for First Time Amid AI Memory Chip Boom
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SK Hynix Overtakes Samsung in Operating Profit for First Time Amid AI Memory Chip Boom

Business Reporter
2 min read

SK Hynix recorded a historic $33 billion operating profit in 2025, surpassing Samsung Electronics' $30.5 billion as AI-driven demand for high-bandwidth memory (HBM) chips reshapes semiconductor industry leadership.

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South Korea's SK Hynix achieved a watershed moment in 2025, generating a record $33 billion operating profit to overtake Samsung Electronics' $30.5 billion in annual operating income for the first time since both companies entered the memory semiconductor market. This leadership shift reflects divergent strategic positioning in the AI hardware revolution, with SK Hynix capturing 58% of the high-margin HBM market compared to Samsung's 38% share (TechInsights Q4 2025 Report).

Market Dynamics Driving the Shift

  • HBM Dominance: SK Hynix supplies 80% of HBM3 chips for NVIDIA's AI accelerators (NVIDIA Q4 Earnings), with HBM commanding 3-5x higher margins than conventional DRAM
  • Pricing Power: Average selling prices for HBM jumped 47% YoY in 2025 versus 12% for standard DRAM (TrendForce)
  • Capacity Allocation: 38% of SK Hynix's DRAM production converted to HBM versus Samsung's 22% (Counterpoint Research)

Strategic Divergence

Samsung maintained higher overall revenue ($65.6B Q4 vs SK Hynix's $58.1B) through diversified semiconductor operations but faced margin compression in foundry and display segments. Meanwhile, SK Hynix's focused HBM roadmap delivered:

  • 72% gross margins on HBM3E production
  • 95% yield rates on 12-layer stacked HBM
  • $10B commitment to new U.S.-based AI infrastructure subsidiary (SK Hynix Announcement)

Structural Industry Shifts

  1. Capital Expenditure: SK Hynix allocated 78% of 2025 capex ($22B) to HBM expansion versus Samsung's 52% ($19B)
  2. Customer Lock-in: Multi-year HBM supply agreements with NVIDIA, AMD, and AWS cover 70% of SK Hynix's 2026 capacity
  3. Technology Lead: SK Hynix's TSV (through-silicon via) architecture achieves 6.4Gbps data rates, 15% faster than competitors

What Comes Next

  • Samsung plans $30B foundry investment targeting 2nm AI chips by 2026 (Samsung Earnings Call)
  • SK Hynix's new $10B U.S. AI Company will vertically integrate memory with compute solutions
  • Industry analysts project HBM revenue will grow at 34% CAGR through 2030, reaching $120B annually (Gartner Forecast)

This profit leadership shift signals that specialized AI memory capabilities now outweigh scale advantages in traditional semiconductors, potentially triggering consolidation among second-tier players like Micron and Kioxia as the $680B chip industry realigns around AI infrastructure demands.

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