HBM

#HBM

24 articles tagged
Chips

SK hynix introduces iHBM thermal architecture to cut HBM heat resistance by 30% for next‑gen AI accelerators

5/26/2026
Memory Dominates AI Chip Budgets – What the Rising HBM Share Means for the Industry
Chips

Memory Dominates AI Chip Budgets – What the Rising HBM Share Means for the Industry

5/24/2026
Hardware

Why AI‑driven HBM demand is pushing up prices for cheap smartphones and other consumer devices

5/23/2026
Intel sidesteps HBM shortage with LPDDR5X on Crescent Island AI GPU – 160 GB of cheaper memory
Chips

Intel sidesteps HBM shortage with LPDDR5X on Crescent Island AI GPU – 160 GB of cheaper memory

5/21/2026
SK Hynix's Explosive Q1 Growth Highlights Memory Chip Boom Fueled by AI Demand
Chips

SK Hynix's Explosive Q1 Growth Highlights Memory Chip Boom Fueled by AI Demand

4/23/2026
Samsung's Semiconductor Dominance Drives Record Q1 2026 Earnings
Chips

Samsung's Semiconductor Dominance Drives Record Q1 2026 Earnings

4/9/2026
Samsung's Q1 Operating Profit Surges 8x to Record $38B Amid AI-Driven Chip Boom
Chips

Samsung's Q1 Operating Profit Surges 8x to Record $38B Amid AI-Driven Chip Boom

4/7/2026
Nvidia's Data Center Roadmap Reveals Stacked Feynman GPUs, Rosa CPUs, and Optical NVLink for 2028
Hardware

Nvidia's Data Center Roadmap Reveals Stacked Feynman GPUs, Rosa CPUs, and Optical NVLink for 2028

3/17/2026
Meta's MTIA Chips Signal Hyperscaler Push to Break Nvidia's AI Dominance
Chips

Meta's MTIA Chips Signal Hyperscaler Push to Break Nvidia's AI Dominance

3/16/2026
Meta Accelerates AI Hardware Roadmap with MTIA 400/450/500 Generations
Chips

Meta Accelerates AI Hardware Roadmap with MTIA 400/450/500 Generations

3/13/2026
ISSCC 2026: AMD's MI355X doubles throughput with fewer compute units - and challenges Nvidia's GB200
Chips

ISSCC 2026: AMD's MI355X doubles throughput with fewer compute units - and challenges Nvidia's GB200

2/27/2026
Chinese Chipmakers Undercut Legacy DRAM Market Amid AI Memory Race
Hardware

Chinese Chipmakers Undercut Legacy DRAM Market Amid AI Memory Race

2/21/2026
Samsung Bets Big on Memory: HBM4 Production, Hybrid Bonding, and Processing-in-Memory Lead AI Infrastructure Push
Hardware

Samsung Bets Big on Memory: HBM4 Production, Hybrid Bonding, and Processing-in-Memory Lead AI Infrastructure Push

2/11/2026

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