Beelink SER10 mini PCs upgrade Ryzen AI 9 HX 470 with 10GbE LAN and dual RAM options
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Beelink SER10 mini PCs upgrade Ryzen AI 9 HX 470 with 10GbE LAN and dual RAM options

Mobile Reporter
2 min read

Beelink's upcoming SER10 mini PCs feature AMD's Ryzen AI 9 HX 470 processors and 10Gb Ethernet ports, with Pro and Max models offering different RAM configurations.

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Beelink's upcoming SER10 series mini PCs represent a strategic evolution rather than a radical overhaul, refining last year's SER9 design with AMD's latest Ryzen AI 9 HX 470 processors and significantly enhanced networking capabilities. While maintaining the compact form factor, these systems introduce meaningful upgrades particularly relevant for developers working with AI workloads and high-bandwidth applications.

The Ryzen AI 9 HX 470 (codenamed Gorgon Point) delivers incremental but valuable improvements over the previous HX 370 (Strix Point) processor:

  • CPU: Increased max boost clock to 5.2GHz (from 5.1GHz)
  • GPU: Radeon 890M graphics boosted to 3.1GHz (from 2.9GHz)
  • NPU: 55 TOPS AI processing (up from 50 TOPS)
  • Same 12-core/24-thread Zen 5 & 5c hybrid architecture
  • Identical 36MB cache and 8533 MT/s memory support
  • Identical 15-54W configurable TDP range

Beelink SER10 mini PCs with Ryzen AI 9 HX 470 and 10 GbE LAN coming soon - Liliputing

The most significant hardware upgrade arrives in the networking department, where both SER10 models replace the previous generation's 2.5GbE ports with full 10Gb Ethernet interfaces. This quadruples potential network throughput - particularly valuable for developers working with network-attached storage, virtualization environments, or high-bandwidth development workflows.

Beelink will offer two distinct models with divergent memory architectures:

Model Memory Configuration Color Options
SER10 Pro Soldered LPDDR5x RAM Silver, Gray, Orange, Green
SER10 Max Dual SODIMM slots (upgradable) Silver, Gray

Both configurations will launch with either 32GB RAM + 1TB storage or 64GB RAM + 1TB storage. The Max model's upgradable memory provides flexibility for developers who anticipate needing to scale memory resources, while the Pro's soldered solution enables more compact thermal designs.

The NPU improvements merit attention for mobile developers targeting AI workloads. The 55 TOPS capability aligns with Microsoft's upcoming Windows Copilot+ PC requirements, suggesting these mini PCs could serve as affordable development platforms for next-gen AI applications. Combined with the Radeon 890M's compute capabilities, developers gain a flexible hardware stack for heterogeneous computing scenarios.

Beelink hasn't announced pricing or exact availability dates beyond confirming the SER10 series is "coming soon." Given the architectural similarities between AMD's Strix Point and Gorgon Point silicon, manufacturers can implement these upgrades with minimal board redesigns, potentially accelerating time-to-market.

For cross-platform developers, these specifications present an intriguing proposition: substantial local compute resources in a compact form factor with enterprise-grade networking. The combination of upgraded NPU, high-bandwidth networking, and flexible memory configurations creates a compelling environment for building and testing applications targeting multiple platforms.

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