Samsung's Exynos 2700 to Shift from FOWLP to Side-by-Side Packaging Architecture

Samsung is preparing to make a significant shift in semiconductor packaging technology with its upcoming Exynos 2700 chipset, which will reportedly power the Galaxy S27 series. According to industry sources, the company plans to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology, which has been used since the Exynos 2400, in favor of a new Side-by-Side (SbS) architecture.

The transition comes as Samsung seeks to address challenges with the current packaging approach. While FOWLP technology has contributed to improved thermal performance in Samsung's mobile chipsets, the manufacturing process has proven to be complex and costly for the company. These factors have reportedly made the technology less profitable despite its technical benefits.

The new Side-by-Side architecture represents a fundamental change in how components are arranged within the SoC. In this design, the application processor (AP) and DRAM will be positioned next to each other on the substrate rather than being stacked vertically. This approach differs significantly from the traditional stacking methods used in many modern mobile processors.

Alongside the architectural shift, Samsung is expected to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700. This technology is designed to improve heat dissipation and overall thermal efficiency, addressing one of the critical challenges in mobile chipset design. Effective thermal management becomes increasingly important as chip manufacturers push for higher performance in smaller form factors.

The Exynos 2700 is anticipated to power the Galaxy S27 and Galaxy S27+ models, which are likely to launch in early 2027. The packaging change could have implications for these devices' thermal performance, power efficiency, and potentially even battery life, as better heat management often allows processors to maintain higher performance for longer periods without thermal throttling.

Packaging technology plays a crucial role in mobile SoC performance beyond just thermal management. It affects signal integrity, power efficiency, and the overall density of components that can be integrated into a given space. Samsung's move to SbS packaging suggests a strategic balance between manufacturing efficiency and technical performance.

For consumers, this packaging change may translate to devices that can sustain peak performance for longer periods, potentially offering better sustained performance in gaming and other intensive applications. The manufacturing efficiency gains could also influence pricing strategies for the Galaxy S27 series.

Samsung's decision to adopt SbS packaging follows broader industry trends in semiconductor manufacturing. Companies are continually exploring new packaging technologies to overcome the physical limitations of Moore's Law and continue improving performance while managing costs and power consumption.

The Exynos 2700's packaging architecture will be particularly interesting to compare against Qualcomm's Snapdragon chips that will likely power some Galaxy S27 models in different regions. This could provide insights into Samsung's competitive positioning and its approach to balancing performance with manufacturing efficiency.

As mobile devices become increasingly powerful and power-efficient, packaging technologies like Samsung's new SbS architecture with HPB technology will play an increasingly important role in shaping the user experience. The thermal characteristics of these devices directly impact performance, battery life, and even device longevity.

Industry analysts will be watching closely to see how Samsung's packaging shift compares to competitors' approaches and whether the new architecture delivers on the promises of improved manufacturing efficiency without compromising thermal performance. The Galaxy S27 series, with its Exynos 2700 chipset, will serve as an important showcase for this new packaging technology.