Xiaomi is reportedly building a smartphone with an active cooling fan integrated into its camera module, likely launching as the Redmi K90 Ultra with MediaTek's Dimensity 9500 chipset and IP68-rated water resistance.

Xiaomi appears to be joining China's growing trend of actively-cooled smartphones, with leaks pointing to a new flagship device featuring an integrated cooling fan within its camera island. According to reliable tipster Digital Chat Station on Weibo, this engineering approach maintains IP68 dust and water resistance despite the moving mechanical component—a significant technical achievement for mobile devices.
The device, strongly believed to be the upcoming Redmi K90 Ultra, will reportedly feature MediaTek's flagship Dimensity 9500 system-on-chip. This aligns with Redmi's historical pattern where Ultra models utilize MediaTek's top-tier processors. The chipset choice suggests Xiaomi is prioritizing sustained performance for demanding tasks like mobile gaming and computational photography, where thermal management becomes critical.
Display specifications include a '1.5K' resolution (approximately 1220p) panel with what's described as an 'ultra-high' refresh rate. Earlier rumors indicate this likely translates to a 6.8-inch LTPS OLED screen with 165Hz refresh capability and ultra-thin bezels featuring pronounced curvature. An ultrasonic under-display fingerprint scanner is also expected, providing faster authentication compared to optical solutions.

The fan's integration into the camera module represents an innovative approach to thermal management. Active cooling allows processors to maintain peak clock speeds longer during intensive workloads, potentially offering tangible benefits for:
- Extended gaming sessions without throttling
- High-resolution video recording stability
- Computational photography processing
- Faster app installations and updates
Remarkably, Xiaomi's engineers appear to have solved the water-resistance challenge typically posed by moving parts. The IP68 rating indicates protection against dust ingress and water immersion up to 1.5 meters for 30 minutes—a standard rarely achieved in fan-equipped electronics.
Powering the device will be a substantial battery reported at 8,000mAh capacity. This aligns with the thermal system's power requirements and addresses the increased energy demands of high-refresh displays and flagship chipsets. The combination suggests Xiaomi is targeting both performance enthusiasts and power users who prioritize all-day usage.
This development reflects China's growing interest in active cooling solutions for smartphones, with brands like Red Magic and Lenovo already offering fan-equipped models. Xiaomi's implementation stands out through its IP68 certification and camera-module integration, potentially setting a new standard for thermal management in mainstream flagships. If these specifications hold, the Redmi K90 Ultra could emerge as a significant contender in the performance-focused smartphone segment when it launches later this year.
For reference, here are Xiaomi's recent Redmi Ultra series devices:
| Model Year | Chipset | Key Feature |
|---|---|---|
| K70 Ultra | Dimensity 9200+ | 120W fast charging |
| K60 Ultra | Dimensity 9200 | 144Hz display |
| K50 Ultra | Snapdragon 8+ Gen1 | 200MP main camera |

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