Overview
TSVs are a key technology for 3D integrated circuits. They allow multiple chips to be stacked vertically and connected directly, rather than using long wires around the edges.
Benefits
- Reduced Latency: Shortens the physical distance signals must travel between stacked chips.
- Higher Bandwidth: Allows for thousands of parallel connections between layers.
- Smaller Footprint: Enables much denser packaging of memory and logic.
Applications
- High Bandwidth Memory (HBM): Stacks of DRAM connected to a GPU.
- 3D V-Cache: AMD's technology for stacking extra L3 cache on top of a CPU die.