Overview
HBM is a specialized type of memory that uses 3D stacking to achieve extremely high bandwidth while maintaining a small physical footprint. It is typically placed very close to the processor (CPU or GPU) on a shared interposer.
Key Features
- Extreme Bandwidth: Offers much higher data transfer rates than traditional DDR or GDDR memory.
- Power Efficiency: Provides better performance per watt by reducing the distance data must travel.
- Compact Design: Stacking memory chips vertically saves significant space on the PCB.
Applications
- High-end GPUs (e.g., NVIDIA H100).
- AI and machine learning accelerators.
- High-performance computing (HPC) clusters.