3D IC

#3D IC

2 articles tagged
Peking University Unveils 3D EDA Tool for Huawei’s LogicFolding Architecture
Chips

Peking University Unveils 3D EDA Tool for Huawei’s LogicFolding Architecture

5/28/2026
Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages
Chips

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

3/6/2026

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