Chips
SK hynix introduces iHBM thermal architecture to cut HBM heat resistance by 30% for next‑gen AI accelerators
5/26/2026

Hardware
Google TPU 8i and TPU 8t: A Deep Dive into Google's Latest AI Accelerators
4/23/2026

Chips
Nvidia Shifts Focus: Rubin CPX Accelerators Removed as Groq 3 LPUs Take Center Stage
3/17/2026

Chips
AMD Denies MI455X Delays as Nvidia's VR200 Platform Rumors Point to Earlier Release
2/17/2026

Chips
Positron's Asimov AI Accelerator Takes on Nvidia with Laptop RAM and CXL Expansion
2/4/2026

Chips
SK Hynix Debuts 16-Layer HBM4 Memory: 48GB at 10 GT/s Targets Next-Gen AI Accelerators
1/15/2026

Chips
Nvidia Denies Upfront Payment Requirement for H200 Orders Amid Geopolitical Uncertainty
1/14/2026

Chips
SK Hynix Commits $12.9 Billion to Advanced Chip Packaging Plant Amid AI-Driven Memory Demand
1/13/2026