Chips
459 articles found
SK Hynix Debuts 16-Layer HBM4 Memory: 48GB at 10 GT/s Targets Next-Gen AI Accelerators
Chips

SK Hynix Debuts 16-Layer HBM4 Memory: 48GB at 10 GT/s Targets Next-Gen AI Accelerators

1/15/2026
Trump Claims Apple and Nvidia Followed US Government into Intel Investment
Chips

Trump Claims Apple and Nvidia Followed US Government into Intel Investment

1/14/2026
HP Considering China-Based DRAM Suppliers as Global Memory Shortage Intensifies
Chips

HP Considering China-Based DRAM Suppliers as Global Memory Shortage Intensifies

1/14/2026
Intel’s Arrow Lake Refresh Targets Spring Launch to Counter AMD’s Early 2026 Offensive
Chips

Intel’s Arrow Lake Refresh Targets Spring Launch to Counter AMD’s Early 2026 Offensive

1/14/2026
GlobalFoundries Acquires Synopsys ARC Processor IP, To Be Integrated Into MIPS
Chips

GlobalFoundries Acquires Synopsys ARC Processor IP, To Be Integrated Into MIPS

1/14/2026
IEDM 2025 Signals Semiconductor Shift: 3D NAND Revival, Copper Alternatives, and Silicon Challengers Reshape Chip Economics
Chips

IEDM 2025 Signals Semiconductor Shift: 3D NAND Revival, Copper Alternatives, and Silicon Challengers Reshape Chip Economics

1/14/2026
Apple Grapples with Critical Chip Component Shortage Amid AI Boom
Chips

Apple Grapples with Critical Chip Component Shortage Amid AI Boom

1/14/2026
Etched's Massive Funding Round Signals Investor Confidence in AI Chip Challengers
Chips

Etched's Massive Funding Round Signals Investor Confidence in AI Chip Challengers

1/14/2026
Nvidia Denies Upfront Payment Requirement for H200 Orders Amid Geopolitical Uncertainty
Chips

Nvidia Denies Upfront Payment Requirement for H200 Orders Amid Geopolitical Uncertainty

1/14/2026
SK Hynix Bets $13 Billion on HBM Packaging as AI Demand Reshapes Memory Industry
Chips

SK Hynix Bets $13 Billion on HBM Packaging as AI Demand Reshapes Memory Industry

1/13/2026
Intel's Open Image Denoise 2.4: AMX-FP16 Delivers 4x Performance Boost on Xeon 6
Chips

Intel's Open Image Denoise 2.4: AMX-FP16 Delivers 4x Performance Boost on Xeon 6

1/13/2026
Redmi Turbo 5 Pro Benchmarks Reveal Unreleased MediaTek Chipset Details
Chips

Redmi Turbo 5 Pro Benchmarks Reveal Unreleased MediaTek Chipset Details

1/13/2026
Samsung Exynos 2700 Leak Points to Major Performance Leap for 2027 Flagships
Chips

Samsung Exynos 2700 Leak Points to Major Performance Leap for 2027 Flagships

1/13/2026

All Categories

AIBackendBusinessChipsCloudCybersecurityDevDevOpsFrontendHardwareInfrastructureLaptopsLLMsMachine LearningMobilePrivacyPythonRegulationRoboticsRustSecurityServerlessSmartphonesStartupsTrendsVulnerabilities