
Chips
DeepSeek V4 Completes Full Adaptation to Huawei Ascend, Marking a Milestone for China AI Stack
5/25/2026

Chips
Huawei Unveils Logic Folding Technology for New Kirin Chip, Set to Power Mate 90 Series
5/25/2026

Chips
Huawei Claims Kirin Chip Breakthrough as China Pushes Semiconductor Self-Sufficiency
5/25/2026

Chips
Memory Dominates AI Chip Budgets – What the Rising HBM Share Means for the Industry
5/24/2026

Chips
AMD CEO Forecasts Five‑Year CPU Demand Boom Driven by AI Infrastructure Rollout
5/24/2026

Chips
Memory Chip Shortage Tightens the Noose on Chinese EV Makers
5/24/2026

Chips
Boox Note X6 gets Snapdragon 6690 “Dragonwing” SoC – What the specs mean for e‑Ink productivity
5/24/2026

Chips
South Korea-Netherlands Semiconductor Partnership Expands Beyond ASML to Photonics and Advanced Technologies
5/24/2026

Chips
Inside the Spacelab Mitra 125 MS: Reverse‑Engineering a 1980‑Era ALU Board
5/23/2026

Chips
z386: Re‑creating the Original 80386 on FPGA
5/23/2026

Chips
$100 CPU Shootout: Ryzen 5 5500 vs Core i3‑12100F vs Core i3‑14100F – Which DDR4 CPU Gives the Best Value in 2026?
5/23/2026

Chips
Micron’s Virginia Fab Starts 1α DDR4 Production, Quadrupling Output and Easing Automotive‑Defense DRAM Shortage
5/23/2026

Chips
From Logic Gates to Systolic Arrays: What Reiner Pope’s MatX Lecture Actually Reveals About AI Chip Design
5/23/2026