
Chips
Samsung begins mass production of HBM4 memory with 3.3TB/s bandwidth
2/12/2026

Chips
Samsung and SK Hynix Warn AI-Driven Memory Shortages Will Persist Until 2027
1/29/2026

Chips
SK Hynix Debuts 16-Layer HBM4 Memory: 48GB at 10 GT/s Targets Next-Gen AI Accelerators
1/15/2026

Chips
SK Hynix Commits $12.9 Billion to Advanced Chip Packaging Plant Amid AI-Driven Memory Demand
1/13/2026